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China Isostatic Graphite Manufacturer, Supplier, Factory

Our commission should be to provide our end users and clients with very best excellent and aggressive portable digital products and solutions for Isostatic Graphite, Porous Graphite, Porous Carbon, SiC Crystal Growth Porous Graphite, Porous Graphite Material, We will do our greatest to meet or exceed customers' demands with top quality items, advanced concept, and productive and timely company. We welcome all customers.
Isostatic Graphite, Being guided by customer demands, aiming at improving the efficiency and quality of customer service, we constantly improve products and provide more comprehensive services. We sincerely welcome friends to negotiate business and start cooperation with us. We hope to join hands with friends in different industries to create a brilliant future.

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  • CVD TaC coating planetary SiC epitaxial susceptor

    CVD TaC coating planetary SiC epitaxial susceptor

    CVD TaC coating planetary SiC epitaxial susceptor is one of the core components of MOCVD planetary reactor. Through CVD TaC coating planetary SiC epitaxial susceptor, the large disk orbits and the small disk rotates, and the horizontal flow model is extended to multi-chip machines, so that it has both the high-quality epitaxial wavelength uniformity management and defect optimization of single-chip machines and the production cost advantages of multi-chip machines.VeTek Semiconductor can provide customers with highly customized CVD TaC coating planetary SiC epitaxial susceptor. If you also want to make a planetary MOCVD furnace like Aixtron, come to us!
  • Ion Beam Sputter sources grid

    Ion Beam Sputter sources grid

    Ion beam is mainly used for ion etching, ion coating and plasma injection. The role of the Ion Beam Sputter sources grid is to dissect the ions and accelerate them to the required energy. Vetek Semiconductor provides high purity graphite ion beam Ion Beam Sputter sources grid for optical lens ion beam polishing, semiconductor wafer modification, etc. Welcome to inquire about customized products.
  • Tantalum Carbide Coated Planetary Rotation Disk

    Tantalum Carbide Coated Planetary Rotation Disk

    VeTek Semiconductor is a leading manufacturer and supplier of Tantalum Carbide Coated Planetary Rotation Disk in China, focusing on TaC coating technology for many years. Our products have high purity and excellent high temperature resistance, which are widely recognized by semiconductor manufacturers. VeTek Semiconductor Tantalum Carbide Coated Planetary Rotation Disk has become the backbone of the wafer epitaxy industry. We look forward to establishing a long-term partnership with you to jointly promote technological progress and production optimization.
  • Wafer Carrier Tray

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    Vetek Semiconductor specializes in partnering with its customers to produce custom designs for Wafer Carrier Tray. Wafer Carrier tray can be designed for use in CVD silicon epitaxy, III-V epitaxy, and III-Nitride epitaxy, Silicon carbide epitaxy. Please contact Vetek semiconductor regarding your susceptor requirements.
  • EDM graphite electrode

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    EDM graphite electrode has the characteristics of moderate density, smooth surface and low cost, and is suitable for chemical industry, metal smelting, etc. VeTek Semiconductor has strong production capacity and rich export experience in EDM graphite electrode products. You are welcome to inquire at any time.

  • ‌Optimization of Defects and Purity in SiC Crystals by TaC Coating

    The TaC coating almost completely eliminates the carbon encapsulation phenomenon by isolating the direct contact between the graphite crucible and the SiC melt, significantly reducing the defect density of microtubes

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    Silicon carbide (SiC) ceramics wafer boats have emerged as indispensable tools in modern semiconductor and photovoltaic fabrication environments. These advanced components play a pivotal role in wafer processing steps such as oxidation, diffusion, epitaxial growth, and chemical vapor deposition.

  • Why is CO₂ Introduced During the Wafer Dicing Process?

    Introducing CO₂ into the dicing water during wafer cutting is an effective process measure to suppress static charge buildup and lower contamination risk, thereby improving dicing yield and long-term chip reliability.

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