Optimization & Mass Production

The greatest challenge in smoothly transitioning from New Product Introduction (NPI) to High-Volume Manufacturing (HVM) is consistency. Through process locking, SPC statistical process control, and in-depth diagnosis of field-returned parts, we ensure that the 1,000th product is indistinguishable in quality from the first sample.

Mass-Production Assurance System:

• Large-Capacity CVD Production Capability & Uniform Thermal Field: Multiple large-size, multi-zone high-purity CVD reactors enable efficient deposition on large graphite substrates, ensuring extremely high consistency of thermal and flow fields during batch production.
• Stringent "Copy-Exact" Control: After mass-production validation, graphite raw-material batches, CNC machining routes, CVD reaction-gas purity, furnace temperature ramp curves, and chamber pressure are locked, minimizing batch-to-batch variation.
• SPC Statistical Process Control: Full-process monitoring of critical metrics such as film-thickness distribution, surface roughness, and resistivity during volume production, driving core parameters to stable convergence with full data traceability.
• In-Depth Diagnosis of Field-Returned Parts: Collaborate with customers to perform microscopic diagnosis (SEM + cross-section analysis) of parts returned from extreme operating conditions, precisely locating local wear and stress-concentration points.
• Dynamic Fine-Tuning of Structure & Process Recipes: Based on real chamber wear data, reverse-optimize component geometry and deposition process parameters to extend the service life of subsequent batches from the source, forming a virtuous cycle.

Real Case & Customer Benefits (Experience):

A leading TOPCon photovoltaic cell manufacturer: During initial introduction, graphite boat accessories exhibited film-thickness variation (±15%) between batches, affecting coating uniformity. We initiated full-process SPC monitoring and locked three critical process parameters (deposition temperature, gas flow rate, chamber pressure). Within 3 weeks, film-thickness uniformity variation was narrowed from ±15% to within ±3%. The line has now been stably supplied for more than 200 batches, with batch pass rate consistently above 99.2%, helping the customer reduce wafer breakage rate by 1.5%.

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