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​In the silicon carbide (SiC) PVT crystal growth process, the stability and uniformity of the thermal field directly determine the crystal growth rate, defect density, and material uniformity. As the system boundary, thermal-field components exhibit surface thermophysical properties whose slight fluctuations are dramatically amplified under high-temperature conditions, ultimately leading to instability at the growth interface.

In the process of growing silicon carbide (SiC) crystals via the Physical Vapor Transport (PVT) method, the extreme high temperature of 2000–2500 °C is a “double-edged sword” — while it drives the sublimation and transport of source materials, it also dramatically intensifies impurity release from all materials within the thermal field system, especially trace metallic elements contained in conventional graphite hot-zone components. Once these impurities enter the growth interface, they will directly damage the core quality of the crystal. This is the fundamental reason why tantalum carbide (TaC) coatings have become a “mandatory option” rather than an “optional choice” for PVT crystal growth.

At Veteksemicon, we navigate these challenges daily, specializing in transforming advanced Aluminum Oxide Ceramics into solutions that meet exacting specifications. Understanding the right machining and processing methods is crucial, as the wrong approach can lead to costly waste and component failure. Let’s explore the professional techniques that make this possible.

Introducing CO₂ into the dicing water during wafer cutting is an effective process measure to suppress static charge buildup and lower contamination risk, thereby improving dicing yield and long-term chip reliability.

Silicon wafers are the foundation of integrated circuits and semiconductor devices. They have an interesting feature - flat edges or tiny grooves on the sides .It is not a defect, but a deliberately designed functional marker.In fact, this notch serves as a directional reference and identity marker throughout the entire manufacturing process.

Chemical mechanical polishing (CMP) removes excess material and surface defects through the combined action of chemical reactions and mechanical abrasion. It is a key process for achieving global planarization of the wafer surface and is indispensable for multilayer copper interconnects and low-k dielectric structures. In practical manufacturing