In the high-stakes world of semiconductor fabrication, precision and stability are everything—and that's where the Electrostatic Chuck (ESC) steps in. Far more than just a holding tool, the ESC uses electrostatic forces to securely clamp wafers during critical processes like etching, deposition, and ion implantation. But how does it actually work? Why is it superior to traditional mechanical clamping? And what role does it play in achieving nanoscale accuracy and throughput efficiency? Welcome to read.
The Dechuck principle of the Electrostatic Chuck is a key part of its workflow that involves electrostatic force elimination and wafer release mechanisms.
Glassy carbon is a non-graphitized carbon that combines the properties of glass and ceramics. It has many properties such as high temperature resistance, corrosion resistance, good electrical conductivity, etc. This blog analyzes the research history and future development trend of glassy carbon, which is worth reading.
In semiconductor manufacturing, various types of semiconductor ceramic components products are needed. These products are used in different production scenarios due to their different characteristics, so as to play their corresponding functions. They are indispensable products in the semiconductor processing industry.
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