In the high-stakes world of semiconductor fabrication, precision and stability are everything—and that's where the Electrostatic Chuck (ESC) steps in. Far more than just a holding tool, the ESC uses electrostatic forces to securely clamp wafers during critical processes like etching, deposition, and ion implantation. But how does it actually work? Why is it superior to traditional mechanical clamping? And what role does it play in achieving nanoscale accuracy and throughput efficiency? Welcome to read.
The Dechuck principle of the Electrostatic Chuck is a key part of its workflow that involves electrostatic force elimination and wafer release mechanisms.
Glassy carbon is a non-graphitized carbon that combines the properties of glass and ceramics. It has many properties such as high temperature resistance, corrosion resistance, good electrical conductivity, etc. This blog analyzes the research history and future development trend of glassy carbon, which is worth reading.
In semiconductor manufacturing, various types of semiconductor ceramic components products are needed. These products are used in different production scenarios due to their different characteristics, so as to play their corresponding functions. They are indispensable products in the semiconductor processing industry.
Tantalum Carbide (TaC) is a high-performance ceramic material known for its extremely high hardness, high melting point and excellent chemical stability. It is widely used in semiconductor, aerospace and other industries requiring extreme heat, wear and corrosion resistance. This article will analyze in detail the structure, physical properties, and specific uses of the finished product in semiconductor manufacturing.
Porous SiC Ceramic Plate is one of the core materials in the field of semiconductor manufacturing. With its unique structure and excellent physical properties, Porous SiC Ceramic Disc has become an irreplaceable key component in high temperature and corrosive environments. In this article, we will deeply analyze its physical properties, application scenarios and selection advantages.
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