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Welcome customers to visit Veteksemicon's SiC Coating/ TaC Coating and Epitaxy Process Factory05 2024-09

Welcome customers to visit Veteksemicon's SiC Coating/ TaC Coating and Epitaxy Process Factory

On September 5, VeTek Semiconductor's customers visited the SiC Coating and TaC Coating factories and reached further agreements on the latest Epitaxial Process solutions.
Welcome Customers to Visit Veteksemicon's Carbon Fiber Products Factory10 2025-09

Welcome Customers to Visit Veteksemicon's Carbon Fiber Products Factory

On September 5, 2025, a customer from Poland visited a factory under VETEK to learn about our advanced technologies and innovative processes in the production of carbon fiber products.
What is CMP Polishing Slurry Preparation Process27 2025-10

What is CMP Polishing Slurry Preparation Process

In semiconductor manufacturing, Chemical Mechanical Planarization (CMP) plays a vital role. The CMP process combines chemical and mechanical actions to smooth the surface of silicon wafers, providing a uniform foundation for subsequent steps such as thin-film deposition and etching. CMP polishing slurry, as the core component of this process, significantly impacts polishing efficiency, surface quality, and the final performance of the product
What is Wafer CMP Polishing Slurry?23 2025-10

What is Wafer CMP Polishing Slurry?

Wafer CMP polishing slurry is a specially formulated liquid material used in the CMP process of semiconductor manufacturing. It consists of water, chemical etchants, abrasives, and surfactants, enabling both chemical etching and mechanical polishing.
Summary of Silicon Carbide (SiC) Manufacturing Process16 2025-10

Summary of Silicon Carbide (SiC) Manufacturing Process

Silicon carbide abrasives are typically produced using quartz and petroleum coke as primary raw materials. In the preparatory stage, these materials undergo mechanical processing to achieve the desired particle size before being chemically proportioned into furnace charge.
How does CMP Technology Reshape the Landscape of Chip Manufacturing24 2025-09

How does CMP Technology Reshape the Landscape of Chip Manufacturing

Over the past few years, the center stage of packaging technology has gradually been ceded to a seemingly "old technology" - CMP (Chemical Mechanical Polishing). When Hybrid Bonding becomes the leading role of the new generation of advanced packaging, CMP is gradually moving from behind the scenes to the spotlight.
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