News

8-inch SiC is now in volume production, but wafer yield — not capacity — separates the winners. This guide explains why TaC coating on graphite hot-zone parts decides yield, and how to qualify a supplier.

In modern chip manufacturing, the substrate provides physical support and a heat dissipation path, while the epitaxial layer determines the electrical performance limits of the device. This article provides an in-depth analysis of the fundamental differences between single-crystal silicon and silicon carbide substrates and CVD/MBE epitaxial processes, and reveals how epitaxial technology enhances the performance of high-frequency and high-voltage devices by reducing defect density and incorporating strain engineering. Whether you are a process engineer or a procurement decision-maker, this guide will help you quickly identify the most suitable wafer selection strategy.

Targeting GTMS/CTMS hermetic sealing processes, VeTek provides customized special graphite fixture solutions with 1,500 densely arrayed micro-holes per 0.01 ㎡. Precisely matching Kovar alloy CTE, overcoming the multi-hole micromachining challenge over 10 months, achieving micron-level zero-defect control and one-stop engineering delivery.