Industry News

In the high-stakes world of power electronics, Silicon Carbide (SiC) and Gallium Nitride (GaN) are spearheading a revolution—from Electric Vehicles (EVs) to renewable energy infrastructure. However, the legendary hardness and chemical inertness of these materials present a formidable manufacturing bottleneck.

In semiconductor manufacturing, the Chemical Mechanical Planarization (CMP) process is the core stage for achieving wafer surface planarization, directly determining the success or failure of subsequent lithography steps. As the critical consumable in CMP, the performance of the Polishing Slurry is the ultimate factor in controlling Removal Rate (RR), minimizing defects, and enhancing overall yield.

In the high-stakes world of semiconductor manufacturing, where precision and extreme environments coexist, Silicon Carbide (SiC) focus rings are indispensable. Known for their exceptional thermal resistance, chemical stability, and mechanical strength, these components are critical to advanced plasma etching processes. The secret behind their high performance lies in Solid CVD (Chemical Vapor Deposition) technology. Today, we take you behind the scenes to explore the rigorous manufacturing journey—from a raw graphite substrate to a high-precision "invisible hero" of the fab.

High-purity quartz materials play a vital role in the semiconductor industry. Their superior high-temperature resistance, corrosion resistance, thermal stability, and light transmission properties make them critical consumables. Quartz products are used for components in both high-temperature and low-temperature zones of wafer production, ensuring the stability and cleanliness of the manufacturing process.

With the global energy transition, the AI revolution, and the wave of new-generation information technologies, silicon carbide (SiC) has rapidly advanced from being a "potential material" to a "strategic foundational material" due to its exceptional physical properties.

In semiconductor high-temperature processes, the handling, supporting, and thermal treatment of wafers rely on a special supporting component—the wafer boat. As process temperatures rise and cleanliness and particle control requirements increase, traditional quartz wafer boats gradually reveal issues such as short service life, high deformation rates, and poor corrosion resistance.