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The electrostatic chuck(ESC), also known as the electrostatic chuck (ESC, e-chuck), is a fixture that uses the principle of electrostatic adsorption to hold and fix the adsorbed material. It is suitable for vacuum and plasma environments. Its main function is to adsorb ultra-clean thin sheets (such as silicon wafers) and keep the adsorbed material at a good flatness, which can also inhibit the deformation of the adsorbed material during the process And it can adjust the temperature of the adsorbate.
An electrostatic chuck (ESC) is a special type of chuck that uses electrostatic force to hold, press and pick up objects (workpieces). Any material carries positive and negative charges that are invisible to the naked eye. When the material is placed on the ESC and a bipolar voltage is applied to the internal electrodes of the ESC, positive and negative charges will move within the material to match the polarity of the internal electrodes of the ESC. This attraction between ESC and the material is called electrostatic force and is also the fundamental principle behind our chucks.
It has a wide operating temperature range (-50 to 700℃)
These electrostatic suction cups feature excellent strength, thermal conductivity and thermal shock resistance, and can adapt to a wide temperature range through NGK's proprietary ceramic volume resistivity control.
High corrosion resistance
These electrostatic suction cups have excellent corrosion resistance to halogen gases.
Low-particle processing
Low-particle treatment can be achieved through surface treatment and special cleaning
High purity
Products with a purity of 99.9% or higher are also available.
Heating function
High-precision heating element embedding technology can be integrated with the heater function, and the wafer temperature can be controlled within ±1%.
Cooling function
These electrostatic suction cups have extremely high cooling performance by bonding ceramic plates with high thermal conductivity and cooling plates.
Radio frequency electrode
Bulk metal electrodes can simultaneously provide stable wafer clamping and radio frequency plasma generation.
Parameter
Project |
Standard Type ESC |
Heating Type ESC |
Low-temperature Type ESC |
Acceptable Wafer Size |
4/6/8/12 Inch |
8/12 Inch |
6/8 Inch (Low-temperature Bonding) |
Working Temperature |
Room Temperature to 200℃ |
50℃-300℃ |
-50℃至100℃ |
Adsorption Force Deviation |
≤±2% |
≤±1.5% |
≤±3% |
Base Plate |
Aluminum Oxide Ceramics |
Aluminium Nitride Ceramics |
Composite Ceramic + Metal Cooling Channel |
1.In the field of semiconductor and electronic manufacturing: During the semiconductor and electronic manufacturing processes, electrostatic suction cups are used to fix and handle thin and fragile silicon wafers, wafers, etc. Its advantages lie in strong adsorption force, no mechanical stress, and simple operation, which effectively improves production efficiency and product quality.
2. Glass and ceramics industry: During the processes of cutting, grinding, and handling of glass and ceramics, electrostatic suction cups can perform non-destructive operations on brittle materials, reducing the product breakage rate.
3. Manufacturing of precision machinery and optical components: For precision machinery and optical components, electrostatic suction cups can provide stable adsorption force, preventing deformation or scratches during processing.
4. Automated production lines: In automated production lines, electrostatic suction cups are widely used in the positioning, handling and assembly of parts, etc., enhancing the degree of automation and efficiency of the production line.
+86-579-87223657
Wangda Road, Ziyang Street, Wuyi County, Jinhua City, Zhejiang Province, China
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