Porous SiC Ceramic Chucks

The Porous SiC Ceramic Chucks offered by Veteksemicon is made from high-purity porous silicon carbide (SiC), this ceramic chuck ensures uniform gas flow, excellent flatness, and thermal stability under high vacuum and temperature conditions. It is ideal for vacuum clamping systems, where non-contact, particle-free wafer handling is critical.

Ⅰ. Key Material Properties & Performance Benefits

1. Excellent Thermal Conductivity & Temperature Resistance

Silicon carbide offers high thermal conductivity (120–200 W/m·K) and can withstand operating temperatures above 1600°C, making the chuck ideal for plasma etching, ion beam processing, and high-temperature deposition processes.

Role: Ensures uniform heat dissipation, reducing wafer warpage and improving process uniformity.

2. Superior Mechanical Strength & Wear Resistance

The dense microstructure of SiC gives the chuck exceptional hardness (>2000 HV) and mechanical durability, essential for repeat wafer loading/unloading cycles and harsh process environments.

Role: Prolongs the chuck's lifespan while maintaining dimensional stability and surface precision.

3. Controlled Porosity for Uniform Vacuum Distribution

The finely tuned porous structure of the ceramic enables consistent vacuum suction across the wafer surface, ensuring secure wafer placement with minimal particle contamination.

Role: Enhances cleanroom compatibility and ensures damage-free wafer processing.

4. Excellent Chemical Resistance

SiC’s inertness to corrosive gases and plasma environments protects the chuck from degradation during reactive ion etching or chemical cleaning.

Role: Minimizes downtime and cleaning frequency, reducing operational cost.

Ⅱ. Veteksemicon's Customization & Support Services

At Veteksemicon, we provide a full spectrum of tailored services to meet the exacting demands of semiconductor manufacturers:

● Custom Geometry & Pore Size Design: We offer chucks in various sizes, thicknesses, and pore densities customized to your equipment specifications and vacuum requirements.

● Fast Turnaround Prototyping: Short lead times and low MOQ production support for R&D and pilot lines.

● Reliable After-Sales Service: From installation guidance to lifecycle monitoring, we ensure long-term performance stability and technical support.

Ⅲ. Applications

● Etching and Plasma Processing Equipment

● Ion Implantation and Annealing Chambers

● Chemical Mechanical Polishing (CMP) Systems

● Metrology and Inspection Platforms

● Vacuum Holding and Clamping Systems in Cleanroom Environments

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