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China Dry Etching Manufacturer, Supplier, Factory

It really is a good way to further improve our goods and service. Our mission would be to acquire inventive items to buyers with a very good encounter for Dry Etching, Semiconductor thermal spraying technology, thermal spraying technology, thermal spraying, Contiguous Wafer Boat, We are keeping durable business relationships with more than 200 wholesalers in the USA, the UK, Germany and Canada. If you are interested in any of our products, please feel free to contact us.
Dry Etching, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective solutions and meticulous after-sales service. We firmly believe that: we're outstanding as we have been specialized.

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    Alumina Ceramic Vacuum Chuck

    VeTek Semiconductor is a professional Alumina Ceramic Vacuum Chuck manufacturer and factory in China. Alumina Ceramic Vacuum Chuck uses high-purity aluminum oxide ceramics with excellent heat resistance, chemical resistance and mechanical strength. It is mainly used to fix and support wafers and substrates. It is a high-performance equipment for semiconductor processing. Welcome your further inquiries.
  • Tantalum Carbide Coating Cover

    Tantalum Carbide Coating Cover

    Tantalum Carbide Coating Cover is composed of high-purity graphite and TaC coating. VeTek Semiconductor is a leading supplier and manufacturer of Tantalum Carbide Coating Cover in China. We focus on providing high-purity, high-temperature resistant tantalum carbide products. Our tantalum carbide coated cover have excellent performance and reliability, and can effectively protect materials in extremely high temperature and corrosive environments. We look forward to becoming your long-term partner in China. Welcome to consult at any time.
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    High purity: The silicon epitaxial layer grown by chemical vapor deposition (CVD) has extremely high purity, better surface flatness and lower defect density than traditional wafers.

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