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Our growth depends within the innovative equipment, fantastic talents and repeatedly strengthened technology forces for Advanced Material, Ultra Pure Silicon Carbide, Silicon Carbide Powder, Crystal Growth, Monocrystal Growth, Our experienced specialized workforce will probably be wholeheartedly at your provider. We sincerely welcome you to check out our web-site and organization and mail us your inquiry.
Advanced Material, Our company mission is that providing high quality and beautiful products with reasonable price and strive to gain 100% good reputation from our clients. We believe Profession achieves excellence! We welcome you to cooperate with us and grow up together.

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    Porous Tantalum Carbide

    VeTek Semiconductor is a professional manufacturer and leader of Porous Tantalum Carbide products in China. Porous Tantalum Carbide is usually manufactured by chemical vapor deposition (CVD) method, ensuring precise control of its pore size and distribution, and is a material tool dedicated to high temperature extreme environments. Welcome your further consultation.
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    Vetek Semiconductor offers Porous SiC Ceramic Chuck widely used in wafer processing technology, transfer and other links, suitable for bonding, scribing, patch, polishing and other links, laser processing. Our Porous SiC Ceramic Chuck has Ultra-strong vacuum adsorption, high flatness and high purity meet the needs of most semiconductor industries.Welcome to inquiry us.
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    The SiC wafer boat is used to carry the wafer,mainly for the oxidation and diffusion process, to ensure that the temperature can be evenly distributed on the wafer surface. The high temperature stability and high thermal conductivity of SiC materials ensure efficient and reliable semiconductor processing. Vetek semiconductor is committed to providing quality products at competitive prices.
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    This article mainly describes the broad application prospects of silicon carbide ceramics. It also focuses on the analysis of the causes of sintering cracks in silicon carbide ceramics and the corresponding solutions.

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    Etching technology in semiconductor manufacturing often encounters problems such as loading effect, micro-groove effect and charging effect, which affect product quality. Improvement solutions include optimizing plasma density, adjusting reaction gas composition, improving vacuum system efficiency, designing reasonable lithography layout, and selecting appropriate etching mask materials and process conditions.

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