Diamond SiC Composite Material

1. Applications

· Semiconductor Packaging & AI Computing: Heat spreaders and thermal-management components for high-power processors.

· Power Electronics: Thermal structures for SiC power devices, IGBT modules and power conversion systems.

· Laser & Optoelectronics: Heat spreaders for laser diodes and other high-power optical devices.

· Aerospace & Precision Engineering: Specialized thermal structures where conductivity, stiffness and dimensional stability matter.

2. Core Advantages

Efficient Heat Transfer: High conductivity can reduce thermal resistance in a properly designed component.

CTE Matching: Adjustable composition helps address thermal mismatch between materials.

Mechanical Stability: Diamond and SiC contribute stiffness and hardness.

Design Flexibility: Material composition, geometry and finishing can be evaluated against application needs.

3. Specifications

The following are preliminary engineering reference ranges, not guaranteed specifications for a qualified VeTek product grade. Final values must be confirmed with the manufacturer and product-specific test reports.

4. Available Product Forms

· Plates and substrates — flat thermal spreaders and packaging substrates.

· Discs and round components — circular heat spreaders and custom discs.

· Custom-machined parts — special geometries and precision-finished components, subject to capability review.

5. Customization Requirements

For evaluation or quotation, please provide available details:

· Drawings, dimensions and tolerances

· Target thermal conductivity and CTE

· Operating temperature and thermal cycling conditions

· Surface finish, metallization or bonding requirements

· Expected quantity and intended application