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Solid SiC Etching Focusing Ring
  • Solid SiC Etching Focusing RingSolid SiC Etching Focusing Ring
  • Solid SiC Etching Focusing RingSolid SiC Etching Focusing Ring
  • Solid SiC Etching Focusing RingSolid SiC Etching Focusing Ring

Solid SiC Etching Focusing Ring

Solid SiC Etching Focusing Ring is one of the core components of wafer etching process, which plays a role in fixing wafer, focusing plasma and improving wafer etching uniformity. As the leading SiC Focusing Ring manufacturer in China, VeTek Semiconductor has advanced technology and mature process, and manufactures Solid SiC Etching Focusing Ring that fully meets the needs of end customers according to customer requirements. We look forward to your inquiry and becoming each other's long-term partners.

VeTek Semiconductor has made great progress in CVD Solid SiC technology and is now able to produce Solid SiC Etching Focusing Ring with world-leading level. VeTek Semiconductor's Solid SiC Etching Focusing Ring is an ultra-high purity silicon carbide material product created through the process of Chemical Vapor Deposition.

Solid SiC etching focusing ring is used in semiconductor manufacturing processes, particularly in plasma etching systems. The SiC focus ring is a crucial component that helps achieve precise and controlled etching of silicon carbide (SiC) wafers.


During the plasma etching process, the focus ring plays multiple roles are as following:

●  Focusing the plasma: The solid SiC etching focusing ring helps shape and concentrate the plasma around the wafer, ensuring that the etching process occurs uniformly and efficiently. It helps confine the plasma to the desired area, preventing stray etching or damage to the surrounding regions.

●  Protecting the chamber walls: The focusing ring acts as a barrier between the plasma and the chamber walls, preventing direct contact and potential damage. SiC is highly resistant to plasma erosion and provides excellent protection for the chamber walls.

●  Temperature control: The sic focus ring aids in maintaining uniform temperature distribution across the wafer during the etching process. It helps dissipate heat and prevents localized overheating or thermal gradients that could affect the etching results.


Solid SiC Etching Focusing Ring in Plasma Etching Equipment


Solid SiC is chosen for focusing rings due to its outstanding thermal and chemical stability, high mechanical strength, and resistance to plasma erosion. These properties make SiC a suitable material for the harsh and demanding conditions inside plasma etching systems.


It's worth noting that the design and specifications of focusing rings can vary depending on the specific plasma etching system and process requirements. VeTek Semiconductor optimizes the shape, dimensions, and surface characteristics of focusing rings to ensure optimal etching performance and longevity. Solid SiC is widely used for wafer carriers, susceptors, dummy wafer, guide rings, parts for etching process, CVD process, etc.


Product parameter of the solid SiC Etching Focus Ring


Physical properties of Solid SiC
Density 3.21 g/cm3
Electricity Resistivity 102 Ω/cm
Flexural Strength 590 MPa (6000kgf/cm2)
Young's Modulus 450 GPa (6000kgf/mm2)
Vickers Hardness 26 GPa (2650kgf/mm2)
C.T.E.(RT-1000℃) 4.0 x10-6/K
Thermal Conductivity(RT) 250 W/mK


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