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Silicon wafers are the foundation of integrated circuits and semiconductor devices. They have an interesting feature - flat edges or tiny grooves on the sides .It is not a defect, but a deliberately designed functional marker.In fact, this notch serves as a directional reference and identity marker throughout the entire manufacturing process.

Chemical mechanical polishing (CMP) removes excess material and surface defects through the combined action of chemical reactions and mechanical abrasion. It is a key process for achieving global planarization of the wafer surface and is indispensable for multilayer copper interconnects and low-k dielectric structures. In practical manufacturing

In 2025, the European semiconductor industry will once again meet at the largest semiconductor trade fair SEMICON Europa in Munich from November 18-21