News

In the era of rapid MEMS (Micro-Electromechanical Systems) evolution, selecting the right piezoelectric material is a make-or-break decision for device performance. PZT (Lead Zirconate Titanate) thin-film wafers have emerged as the premier choice over alternatives like AlN (Aluminum Nitride), offering superior electromechanical coupling for cutting-edge sensors and actuators.

As semiconductor manufacturing continues to evolve toward advanced process nodes, higher integration, and complex architectures, the decisive factors for wafer yield are undergoing a subtle shift. For customized semiconductor wafer manufacturing, the breakthrough point for yield no longer lies solely in core processes like lithography or etching; high-purity susceptors are increasingly becoming the underlying variable affecting process stability and consistency.

In the world of wide-bandgap (WBG) semiconductors, if the advanced manufacturing process is the "soul," the graphite susceptor is the "backbone," and its surface coating is the critical "skin."