The AMAT Cover Top Quartz 8" PCII (0200-00218) is a high-purity quartz component designed for Applied Materials Endura PVD chambers, delivering excellent contamination control, plasma stability, and extended service life. Engineered for 200mm semiconductor processes, it serves as a critical protective and insulating element in the chamber top region, helping improve yield and process consistency. Vetek Semiconductor offers precision-manufactured, OEM-compatible quartz parts with reliable performance and global supply capability. We welcome your inquiry.
The AMAT Cover Top Quartz 8 inch PCII (Part No. 0200-00218) is a high-purity quartz component designed for use in 200mm (8-inch) PVD process chambers, specifically compatible with Applied Materials Endura® platform (PCII chamber).
Manufactured from ultra-high purity fused quartz, this component plays a critical role in maintaining a clean and stable deposition environment by minimizing contamination and ensuring consistent plasma behavior.
At Vetek Semiconductor, we provide precision-engineered quartz parts with strict material control and dimensional accuracy, offering reliable alternatives for semiconductor fabs and equipment service providers.
Key Specifications:
Product Name
Cover Top Quartz
Part Number
0200-00218
Wafer Size
8 inch (200mm)
Material
High-Purity Fused Quartz
Application
PVD (Physical Vapor Deposition)
Compatible Equipment
Applied Materials Endura® (PCII Chamber)
Process Application & Chamber Position
This quartz cover is specifically designed for PVD sputtering processes, widely used in semiconductor manufacturing for metal thin film deposition such as aluminum (Al), titanium (Ti), and copper (Cu).
Chamber Position
The component is installed in the upper section of the PVD chamber, commonly referred to as the top cover region, where it is exposed to:
● Plasma discharge zones
● Process gas flow paths
● Metal particle deposition environments
Functional Role in the Chamber
Within the chamber structure, the Cover Top Quartz serves as a non-metallic protective barrier and insulating element, positioned above the wafer and near the target region.
Its placement is critical for:
● Shielding sensitive chamber components from metal deposition
● Maintaining electrical insulation in RF plasma environments
● Supporting stable and repeatable process conditions
Core Functions & Performance Advantages
1) Contamination Control
During PVD processes, sputtered metal atoms tend to deposit not only on wafers but also on internal chamber surfaces.
This quartz cover:
● Acts as a sacrificial protective layer
● Prevents metal buildup on critical chamber structures
● Reduces particle generation and cross-contamination
Result: Improved wafer yield and process cleanliness
2) Plasma Stability & Electrical Insulation
Thanks to its excellent dielectric properties, high-purity quartz ensures:
● Stable RF field distribution
● Reduced risk of electrical interference
● Consistent plasma density across process cycles
Result: Enhanced film uniformity and repeatability
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