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Solid SiC Focus Rings
  • Solid SiC Focus RingsSolid SiC Focus Rings

Solid SiC Focus Rings

Designed to surround the wafer tracking zone, the Solid SiC Focus Ring ensures linear plasma distribution and exact edge-to-center etch profiles.These premium β-SiC components are built by Vetek Semiconductor (Wuyi Tianyao New Material Technology Co., LTD) using proprietary Chemical Vapor Deposition (CVD) technology. By vaporizing raw materials into a dense, binderless matrix, Vetek eliminates the porous micro-gaps common in older materials. Compared to standard quartz or silicon shielding, our CVD SiC components stand up far better to corrosive halogen gases, shielding the wafer in deep sub-7nm logic and dense memory chip manufacturing.Looking forward to your further inquiry.

1. Product Features


● Purity (GDMS Verified): > 99.99995% (Up to 6N-7N) | Keeps the chamber free of trace metal risks.

● Structural Solidness: ≥3.21  g/cm3 | Reaches theoretical density; leaves no voids for outgassing or micro-particles to hide.

● Thermal Regulation: 200 - 300W/m·K | Spreads heat rapidly to keep wafer-rim temperatures perfectly even.

● Electrical Range: 0.01 - 10 Ωcm | Adaptable resistivity to steady the plasma sheath and refine RF connection.Surface Rigidity: ≥2500 HV | Resists abrasive wear during continuous dry-etching cycles.

Solid SiC focus ring Manufacturing Processing



2. Applicationsl 


● Advanced process plasma etching

● Thin film deposition processes (PECVD/ALD)

● Solid SiC etching rings are key consumables in advanced chip manufacturing, used to ensure the uniformity of wafer edge processes, improve yield and extend component life in plasma etching and deposition processes.


3. Resolving Fab Vulnerabilities


● Issue: Costly Idle Time from Fast Part Erosion

The Fix:  Vetek’s CVD-grown structure shows an erosion pace 10 to 20 times slower than quartz and 3 to 5 times slower than bulk silicon. Fabs get longer production runs and far fewer emergency chamber vents.

● Issue: Edge Yield Collapse ("The Edge Effect")

The Fix: Slow, predictable wear across the ring face stops the plasma sheath from tilting over time. This preserves tight Critical Dimension (CD) limits right at the wafer perimeter.

● Issue: Defect Spikes from Sintered-Part Shedding

The Fix: Our gas-phase synthesis leaves behind zero grain-boundary binders or metallic fillers. Without these weak spots, the ring won't flake or cause micro-masking defects on the wafer surface.


4. Tailored Engineering Support


● Tool Drop-In Integration: Custom-machined to match the strict spacing specs of global etcher brands like Lam, AMAT, and TEL.

● Resistivity Matching: We tune the electrical profile of each batch to line up perfectly with your specific recipe parameters.

● Advanced Finishes: Employs ultra-clean Chemical Mechanical Planarization (CMP) to smoothen rough surfaces, lowering particle counts during early tool seasoning.

● Intricate Form-Factors: We hold tight tolerances (±0.01mm) on tricky, multi-stepped edge rings and interlocking ring setups.


Vetek Semiconductor Warehouse:

Veteksemicon Warehouse
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