Vacuum chuck

Application: 

A high efficiency vacuum chuck crafted for the precise adsorption and firm fixation of wafers and ingots. It is well - suited for situations including semiconductor manufacturing, wafer cutting, precision processing, high - temperature epitaxy, etching, and ion implantation.

Core Parameters:

● Adjustable porosity (ranging from 10 - 200μm).
● Capable of withstanding ultra - high temperatures (up to ≤1600°C) and showing excellent thermal shock resistance.
● Adsorption vacuum: The standard is - 90kPa (customizable to reach 100kPa).

● Suction cup dimensions: Can support 4/6/8/12 - inch wafers, and the ingot size can be tailored according to specific needs.

Ⅰ. Description

Veteksemicon ceramic vacuum chuck uses a combined structure of porous ceramic and a metal outer ring. Through the personalized design of air channels and pores, it realizes an even distribution of adsorption force and high stability. This chuck is fitting for semiconductor manufacturing, wafer cutting, precision processing, etc. It can operate in high - temperature and high - speed motion settings and meets the compatibility requirements of wafers/ingots in different sizes.

Ⅱ. Core Structure and Material Advantages

Multilayer Composite Layout:

✔ Surface Layer: Made of porous ceramic (you can choose between porous silicon carbide or porous graphite). The pore diameter can be adjusted (10 - 200μm), which guarantees that the adsorption force is evenly transferred to the wafer's surface, thus preventing local stress build - up.

✔ Matrix: Composed of a highly rigid metal frame (either stainless steel or aluminum alloy) to offer structural support and airtightness.

✔ Airways and Pores: The precisely machined internal airways form a network, along with evenly spaced micropores. This setup supports quick vacuum extraction (adsorption force can reach up to - 90kPa) and instant release.

Ⅲ . Comparison of Material Characteristics

1. Comparison of material properties

2. Application Scenarios and Cases

✔ Semiconductor Fabricatio

Epitaxial Growth: It can firmly adsorb SiC wafers at high temperatures, preventing the wafers from warping and getting contaminated.

Lithography and Etching: It enables precise positioning on high - speed moving platforms (acceleration ≤10G), ensuring the accuracy of graphic alignment.

✔ Ingot Processing

Cutting and Grinding: It can adsorb heavy ingots (such as sapphire and silicon - carbide ingots), reducing edge cracking due to vibration.

✔ Scientific Research and Special Technologies

High - Temperature Annealing: Porous silicon - carbide suction cups can work continuously at 1600°C without deformation or venting pollution.

Vacuum Coating: With a high - air - tightness design, it can adapt to the PVD/CVD cavity environment.

3. Customized Service

✔ We offer customization for size and load.

✔ The stomata and airway can be optimized to meet specific requirements.

✔ It can be adapted to special environments.

Ⅳ. FAQ:

How do Vacuum chucks achieve multi-size wafer compatibility (e.g. 12/8/6 ") ?

Q: How does a single chuck fit into a 12-inch, 8-inch, and 6-inch wafer at the same time? Is physical restructuring necessary?

A:Multi-dimensional compatibility through adaptive airway and stomatal partitioning:

✔ Dynamic stomatal control: The stomata on the surface of the sucker are distributed in a ring area, and the air circuit in different areas is controlled by an external valve.

For example, when absorbing an 8-inch wafer, only the pores in the central area are enabled and the outer pores are closed (to avoid leakage of adsorption force).

✔ Flexible airway design: The port network has a modular layout that matches the edge profiles of wafers of different sizes to ensure uniform adsorption force coverage. and Advantages are as followings:

Zero hardware replacement: No need to remove or replace the suction cup, through software or gas valve switch can be adapted to different sizes.

Cost savings: Reduce equipment renovation costs and downtime, and increase production line flexibility.