SiC Cantilever Paddles

Ⅰ.Product Usage Overview

SiC cantilever paddles are mainly used in semiconductor production equipment as wafer support and transmission components. Its core function is to stably and accurately process silicon wafers under extreme process conditions such as high temperature and high corrosion, ensuring a smooth and efficient production process.

Ⅱ.Advantages and characteristics of SiC materials

SiC is an advanced ceramic material whose excellent physical properties give it an unparalleled advantage in the semiconductor field. The following are the key physical parameters related to SiC cantilever paddles:

● High purity: The use of high-purity SiC material can minimize process contamination and improve product yield.

● Excellent high temperature resistance: SiC has a melting point of up to 2830°C, which enables it to maintain structural integrity in extreme temperature environments such as plasma etching and high-temperature annealing, and the long-term operating temperature can reach more than 1000°C.

● High hardness and wear resistance: The Mohs hardness is 9-9.5, second only to diamond, giving SiC cantilever paddles excellent wear resistance and maintaining dimensional stability during high-frequency wafer transmission.

● Excellent thermal conductivity: The thermal conductivity of SiC ceramics is as high as 120-250 W/(m·K) (typical value), which can quickly dissipate heat and avoid local overheating that may damage the wafer.

● Low thermal expansion coefficient: The low thermal expansion coefficient (about 4.0 × 10⁻⁶ /K) ensures dimensional stability when the temperature changes, avoids stress caused by thermal expansion and contraction, and thus reduces the risk of wafer damage.

Ⅲ. Application Scenarios of SiC Cantilever Paddles

The unique properties of SiC cantilever paddles enable them to play a key role in multiple links of semiconductor manufacturing:

● Plasma etching equipment: In the plasma etching chamber, SiC cantilever paddles serve as wafer supports, which can withstand plasma bombardment and corrosive gas erosion while maintaining dimensional stability, ensuring etching accuracy and extending equipment life.

● Thin film deposition equipment (CVD/PVD): In the process of chemical vapor deposition (CVD) and physical vapor deposition (PVD), SiC cantilever paddles are used to support wafers. Their excellent high temperature resistance and thermal conductivity help to uniformly heat the wafers and prevent particle contamination generated during the thin film deposition process.

● Wafer transfer system: In the automated wafer transfer system, SiC cantilever paddles can withstand high-frequency mechanical movement due to their high hardness and wear resistance, ensuring accurate and fast transfer of wafers between different process chambers, reducing the risk of wafer damage and contamination.

● High temperature annealing process: In the high temperature annealing furnace, SiC cantilever paddles can withstand ultra-high temperature environments, provide stable support for wafers, and ensure the uniformity and effectiveness of the annealing process.

Veteksemicon is well aware of the stringent requirements of semiconductor processes for product quality. Therefore, we support customized services and can provide customized SiC cantilever paddle design and production according to your specific equipment and process requirements. And we will also control strict quality control to ensure that each product undergoes strict quality inspections to ensure that it meets the highest industry standards.

More importantly, Vetek Semiconductor's technical team will provide you with comprehensive technical consultation and product solutions. Choosing our SiC cantilever paddle means choosing higher production efficiency, longer equipment life and better product yield. Looking forward to your further consultation.