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Silicon Carbide Coating Wafer Holder
  • Silicon Carbide Coating Wafer HolderSilicon Carbide Coating Wafer Holder

Silicon Carbide Coating Wafer Holder

The Silicon Carbide Coating Wafer Holder by Veteksemicon is engineered for precision and performance in advanced semiconductor processes such as MOCVD, LPCVD, and high-temperature annealing. With a uniform CVD SiC coating, this wafer holder ensures exceptional thermal conductivity, chemical inertness, and mechanical strength — essential for contamination-free, high-yield wafer processing.

The Silicon Carbide (SiC) Coating Wafer Holder is an essential component in semiconductor manufacturing, specifically designed for ultra-clean, high-temperature processes such as MOCVD (Metal Organic Chemical Vapor Deposition), LPCVD, PECVD, and thermal annealing. By integrating a dense and uniform CVD SiC coating on a robust graphite or ceramic substrate, this wafer carrier ensures both mechanical stability and chemical inertness under harsh environments.


Ⅰ. Core Function in Semiconductor Processing


In semiconductor fabrication, wafer holders play a pivotal role in ensuring wafers are securely supported, uniformly heated, and protected during deposition or thermal treatment. The SiC coating provides an inert barrier between the base substrate and the process environment, effectively minimizing particle contamination and outgassing, which are critical to achieving high device yield and reliability.


Key Applications Include:


● Epitaxial growth (SiC, GaN, GaAs layers)

● Thermal oxidation and diffusion

● High-temperature annealing (>1200°C)

● Wafer transfer and support during vacuum and plasma processes


Ⅱ. Superior Physical Characteristics


Basic physical properties of CVD SiC coating
Property
Typical Value
Crystal Structure
FCC β phase polycrystalline, mainly (111) oriented
Density
3.21 g/cm³
Hardness
2500 Vickers hardness(500g load)
Grain Size
2~10μm
Chemical Purity
99.99995%
Heat Capacity
640 J·kg-1·K-1
Sublimation Temperature
2700℃
Flexural Strength
415 MPa RT 4-point
Young' s Modulus
430 Gpa 4pt bend, 1300℃
Thermal Conductivity
300W·m-1·K-1
Thermal Expansion(CTE)
4.5×10-6K-1


These parameters demonstrate the wafer holder’s capability to maintain performance stability even under rigorous process cycles, making it ideal for next-generation device manufacturing.


Ⅲ. Process Workflow – Step-by-Step Application Scenario


Let’s take MOCVD epitaxy as a typical process scenario to illustrate the usage:


1. Wafer Placement: The silicon, GaN, or SiC wafer is gently placed onto the SiC-coated wafer susceptor.

2. Chamber Heating: The chamber is heated rapidly to high temperatures (~1000–1600°C). SiC coating ensures efficient thermal conduction and surface stability.

3. Precursor Introduction: Metal-organic precursors flow into the chamber. The SiC coating resists chemical attacks and prevents outgassing from the substrate.

4. Epitaxial Layer Growth: Uniform layers are deposited without contamination or thermal distortion, thanks to the excellent flatness and chemical inertness of the holder.

5. Cool Down & Extraction: After processing, the holder allows safe thermal transition and wafer retrieval without particle shedding.


By maintaining dimensional stability, chemical purity, and mechanical strength, the SiC Coating Wafer susceptor significantly improves process yield and reduces tool downtime.


CVD SIC FILM CRYSTAL STRUCTURE:

CVD SIC FILM CRYSTAL STRUCTURE


Veteksemicon Product Warehouse:

Veteksemicon Product Warehouse


Hot Tags: Silicon carbide wafer holder, SiC coated wafer support, CVD SiC wafer carrier, high temperature wafer tray, thermal process wafer holder
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