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SiC Ceramic vacuum chuck for wafer
  • SiC Ceramic vacuum chuck for waferSiC Ceramic vacuum chuck for wafer

SiC Ceramic vacuum chuck for wafer

Veteksemicon SiC Ceramic Vacuum Chuck for Wafer is engineered to deliver exceptional precision and reliability in semiconductor wafer processing. Manufactured from high-purity silicon carbide, it ensures excellent thermal conductivity, chemical resistance, and superior mechanical strength, making it ideal for demanding applications such as etching, deposition, and lithography. Its ultra-flat surface guarantees stable wafer support, minimizing defects and improving process yield. this vacuum chuck is the trusted choice for high-performance wafer handling.

Veteksemicon sic ceramic vacuum chuck for wafer is a core component developed specifically for third-generation semiconductor manufacturing, optimized for the high-temperature, high-pressure processing environments experienced by wafers. Made from high-purity ceramic materials, precision machining, and specialized surface treatment ensure stable vacuum holding performance and excellent thermal stability in the demanding semiconductor manufacturing process.Our vacuum chucks have been field-proven by hundreds of semiconductor manufacturers, demonstrating excellent performance in critical processes such as SiC epitaxy, ion implantation, and photolithography. They effectively address wafer warpage and positioning accuracy issues caused by high material hardness and high process temperatures.


General product information

Place of Origin:
China
Brand Name:
Veteksemicon
Model Number:
SIC Ceramic vacuum chuck for wafer-01
Certification:
ISO9001


Product business terms

Minimum Order Quantity:
Subject to negotiation
Price:
Contact for Customized Quotation
Packaging Details:
Standard export package
Delivery Time:
Delivery Time: 30-45 Days After Order Confirmation
Payment Terms:
T/T
Supply Ability:
1000units/Month


Application: Veteksemicon ceramic vacuum chuck for wafer is made of high-performance ceramic materials and precision-machined to ensure an ultra-flat surface and excellent thermal stability. It provides reliable wafer adsorption and temperature control solutions for processes such as epitaxial growth, ion implantation, and photolithography, effectively improving process yield and production efficiency..

Services that can be provided: customer application scenario analysis, matching materials, technical problem solving.

Company profile:Veteksemicon has 2 laboratories, a team of experts with 20 years of material experience, with R&D and production, testing and verification capabilities.


Technical Parameters

parameter
Alumina substrate
Silicon carbide substrate
Thermal conductivity
25-30 W/(m·K)
180-220 W/(m·K)
Coefficient of thermal expansion
7.2×10⁻⁶/K
4.5×10⁻⁶/K
Maximum operating temperature
450°C
580°C
Bulk density
3.89 g/cm³
3.10 g/cm³


Veteksemicon ceramic vacuum chuck for wafer core advantages


 ● Materials science breakthrough

Veteksemicon utilizes a unique material formulation and sintering process to significantly enhance the mechanical strength and thermal stability of its products while maintaining the excellent insulation properties of ceramic materials. Our alumina-based ceramics utilize high-purity raw materials and a special additive formulation, ensuring excellent dimensional stability even in high-temperature environments. Our silicon carbide-based ceramics, through an optimized sintering process, achieve higher thermal conductivity and improved thermal matching, making them particularly well-suited for high-temperature SiC wafer processing.


 ● Excellent thermal management performance

Our unique multi-layer design and precision machining ensure that the chuck maintains excellent thermal uniformity even under high-temperature operating conditions. The silicon carbide chuck boasts a thermal conductivity exceeding 200W/m·K, enabling rapid temperature balancing and maintaining wafer surface temperature variations within ±0.8°C. This superior thermal management capability effectively avoids process defects caused by temperature variations and significantly improves product yield.


● Ultra-precision machining technology

Veteksemicon boasts leading precision machining centers in China, utilizing unique grinding and polishing processes to achieve submicron surface flatness. Our silicon carbide chucks achieve surface flatness within 0.8μm, with a surface roughness Ra value of no more than 0.1μm. This ultra-precision surface quality ensures a perfect fit between the wafer and the chuck, providing a reliable flat reference for precision processes such as photolithography.


● Improved service life

Through optimized material formulations and reinforced structural design, our products have a service life exceeding 40% compared to traditional products. Special edge reinforcement and surface coating technologies enable our products to withstand frequent clamping and cleaning operations. Alumina-based products are guaranteed to operate over 200,000 times, while silicon carbide-based products can reach over 500,000 cycles, significantly reducing operating costs for our customers.


● Ecological chain verification endorsement

Veteksemicon ceramic vacuum chuck for wafer' ecological chain verification covers raw materials to production, has passed international standard certification, and has a number of patented technologies to ensure its reliability and sustainability in the semiconductor and new energy fields.


For detailed technical specifications, white papers, or sample testing arrangements, please contact our Technical Support Team to explore how Veteksemicon can enhance your process efficiency.


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