CMP Polishing Slurry

CMP polishing slurry (Chemical Mechanical Polishing Slurry) is a high-performance material used in semiconductor manufacturing and precision material processing. Its core function is to achieve fine flatness and polishing of the material surface under the synergistic effect of chemical corrosion and mechanical grinding to meet the flatness and surface quality requirements at the nano level. Looking forward to your further consultation.

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Product Description

Veteksemicon's CMP polishing slurry is mainly used as a polishing abrasive in the CMP chemical mechanical polishing slurry for planarizing semiconductor materials. It has the following advantages:

● The diameter and particle association degree of the particles can be freely controlled;
● The particles are monodispersed and the particle size distribution is uniform;
● The dispersion system is stable;
● The mass production scale is large and the difference between batches is small;
● It is not easy to condense and settle.

Performance Indicators for Ultra-High Purity Series Products

Parameter	Unit	Performance Indicators for Ultra-High Purity Series Products
Parameter	Unit	VESC-1	VESC-2	VESC-3	VESC-4	VESC-5	VESC-6	VESC-7
Average Silica Particle Size	nm	35±5	45±5	65±5	75±5	85±5	100±5	120±5
Nanoparticle Size Distribution (PDI)	1	<0.15	<0.15	<0.15	<0.15	<0.15	<0.15	<0.15
Solution pH	1	7.2-7.4	7.2-7.4	7.2-7.4	7.2-7.4	7.2-7.4	7.2-7.4	7.2-7.4
Solid Content	%	20.5±0.5	20.5±0.5	20.5±0.5	20.5±0.5	20.5±0.5	20.5±0.5	20.5±0.5
Appearance	--	Light Blue	Blue	White	Off-White	Off-White	Off-White	Off-White
Particle Morphology X	X：S- pherical；B- Curved；P- Peanut-shaped；T- Bulbous；C- Chain-like (aggregated state)
Stabilizing Ions	Organic / Inorganic Amines
Raw Material Composition Y	Y：M-TMOS；E-TEOS；ME-TMOS+TEOS；EM-TEOS+TMOS
Metal Impurity Content	≤ 300ppb