Industry News

As semiconductor manufacturing continues to evolve toward advanced process nodes, higher integration, and complex architectures, the decisive factors for wafer yield are undergoing a subtle shift. For customized semiconductor wafer manufacturing, the breakthrough point for yield no longer lies solely in core processes like lithography or etching; high-purity susceptors are increasingly becoming the underlying variable affecting process stability and consistency.

In the world of wide-bandgap (WBG) semiconductors, if the advanced manufacturing process is the "soul," the graphite susceptor is the "backbone," and its surface coating is the critical "skin."

In the high-stakes world of power electronics, Silicon Carbide (SiC) and Gallium Nitride (GaN) are spearheading a revolution—from Electric Vehicles (EVs) to renewable energy infrastructure. However, the legendary hardness and chemical inertness of these materials present a formidable manufacturing bottleneck.