Industry News

In semiconductor high-temperature processes, the handling, supporting, and thermal treatment of wafers rely on a special supporting component—the wafer boat. As process temperatures rise and cleanliness and particle control requirements increase, traditional quartz wafer boats gradually reveal issues such as short service life, high deformation rates, and poor corrosion resistance.

For industrial-scale production of silicon carbide substrates, the success of a single growth run is not the end goal. The real challenge lies in ensuring that crystals grown across different batches, tools, and time periods maintain a high level of consistency and repeatability in quality. In this context, the role of tantalum carbide (TaC) coating goes beyond basic protection—it becomes a key factor in stabilizing the process window and safeguarding product yield.

​Silicon carbide (SiC) PVT growth involves severe thermal cycling (room temperature above 2200 ℃). The enormous thermal stress generated between the coating and the graphite substrate due to the mismatch in coefficients of thermal expansion (CTE) is the core challenge determining coating lifetime and application reliability.