Industry News

Introducing CO₂ into the dicing water during wafer cutting is an effective process measure to suppress static charge buildup and lower contamination risk, thereby improving dicing yield and long-term chip reliability.

Silicon wafers are the foundation of integrated circuits and semiconductor devices. They have an interesting feature - flat edges or tiny grooves on the sides .It is not a defect, but a deliberately designed functional marker.In fact, this notch serves as a directional reference and identity marker throughout the entire manufacturing process.

Chemical mechanical polishing (CMP) removes excess material and surface defects through the combined action of chemical reactions and mechanical abrasion. It is a key process for achieving global planarization of the wafer surface and is indispensable for multilayer copper interconnects and low-k dielectric structures. In practical manufacturing