CVD TaC Coating Wafer Carrier

During the semiconductor manufacturing process, VeTek Semiconductor’s CVD TaC Coating Wafer Carrier is a tray used to carry wafers. This product uses a chemical vapor deposition (CVD) process to coat a layer of TaC Coating on the surface of the Wafer Carrier substrate. This coating can significantly improve the oxidation and corrosion resistance of the wafer carrier, while reducing particle contamination during processing. It is an important component in semiconductor processing.

VeTek Semiconductor’s CVD TaC Coating Wafer Carrier is composed of a substrate and a tantalum carbide (TaC) coating.

The thickness of tantalum carbide coatings is typically in the 30 micron range, and TaC has a melting point as high as 3,880°C while providing excellent corrosion and wear resistance, among other properties.

Carrier's base material is made of high-purity graphite or silicon carbide (SiC), and then a layer of TaC (Knoop hardness up to 2000HK) is coated on the surface through a CVD process to improve its corrosion resistance and mechanical strength.

During the wafer process, VeTek Semiconductor's CVD TaC Coating Wafer Carrier may play the following important roles:

1. Protection of wafers

Physical protection The carrier serves as a physical barrier between the wafer and external mechanical damage sources. When wafers are transferred between different processing equipment, such as between a chemical - vapor deposition (CVD) chamber and an etching tool, they are prone to scratches and impacts. The CVD TaC coating wafer carrier has a relatively hard and smooth surface that can withstand normal handling forces and prevent direct contact between the wafer and rough or sharp objects, thus reducing the risk of physical damage to the wafers.

Chemical protection TaC has excellent chemical stability. During various chemical treatment steps in the wafer process, such as wet etching or chemical cleaning, the CVD TaC coating can prevent the chemical agents from coming into direct contact with the carrier material. This protects the wafer carrier from corrosion and chemical attack, ensuring that no contaminants are released from the carrier onto the wafers, thereby maintaining the integrity of the wafer surface chemistry.

2. Support and alignment

Stable support The wafer carrier provides a stable platform for wafers. In processes where wafers are subjected to high - temperature treatment or high - pressure environments, such as in a high - temperature furnace for annealing, the carrier must be able to support the wafer evenly to prevent warping or cracking of the wafer. The proper design and high - quality TaC coating of the carrier ensure uniform stress distribution across the wafer, maintaining its flatness and structural integrity.

Precise alignment Accurate alignment is crucial for various lithography and deposition processes. The wafer carrier is designed with precise alignment features. The TaC coating helps to maintain the dimensional accuracy of these alignment features over time, even after multiple uses and exposure to different processing conditions. This ensures that the wafers are accurately positioned within the processing equipment, enabling precise patterning and layering of semiconductor materials on the wafer surface.

3. Heat transfer

Uniform heat distribution In many wafer processes, such as thermal oxidation and CVD, precise temperature control is essential. The CVD TaC coating wafer carrier has good thermal conductivity properties. It can evenly transfer heat to the wafer during heating operations and remove heat during cooling processes. This uniform heat transfer helps to reduce temperature gradients across the wafer, minimizing thermal stresses that could cause defects in the semiconductor devices being fabricated on the wafer.

Enhanced heat - transfer efficiency The TaC coating can improve the overall heat - transfer characteristics of the wafer carrier. Compared to uncoated carriers or carriers with other coatings, the TaC coating surface may have a more favorable surface - energy and texture for heat exchange with the surrounding environment and the wafer itself. This results in more efficient heat transfer, which can shorten the processing time and improve the production efficiency of the wafer manufacturing process.

4. Contamination control

Low - outgassing properties The TaC coating typically exhibits low outgassing behavior, which is crucial in the clean environment of the wafer fabrication process. Outgassing of volatile substances from the wafer carrier can contaminate the wafer surface and the processing environment, leading to device failures and reduced yields. The low - outgassing nature of the CVD TaC coating ensures that the carrier does not introduce unwanted contaminants into the process, maintaining the high - purity requirements of semiconductor manufacturing.

Particle - free surface The smooth and uniform nature of the CVD TaC coating reduces the likelihood of particle generation on the carrier surface. Particles can adhere to the wafer during processing and cause defects in the semiconductor devices. By minimizing particle generation, the TaC coating wafer carrier helps to improve the cleanliness of the wafer manufacturing process and increase the product yield.

Tantalum carbide (TaC) coating on a microscopic cross-section:

Basic physical properties of CVD TaC coating：

VeTek Semiconductor CVD TaC Coating Wafer Carrier production shops: