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Large sized resistance heating SiC crystal growth furnace
  • Large sized resistance heating SiC crystal growth furnaceLarge sized resistance heating SiC crystal growth furnace

Large sized resistance heating SiC crystal growth furnace

Silicon carbide crystal growth is a core process in the manufacturing of high-performance semiconductor devices. The stability, precision, and compatibility of crystal growth equipment directly determine the quality and yield of silicon carbide ingots. Based on the characteristics of Physical Vapor Transport (PVT) technology, Veteksemi has developed a resistance heating furnace for silicon carbide crystal growth, enabling stable growth of 6-inch, 8-inch, and 12-inch silicon carbide crystals with full compatibility with conductive, semi-insulating, and N-type material systems. Through precise control of temperature, pressure, and power, it effectively reduces crystal defects such as EPD (Etch Pit Density) and BPD (Basal Plane Dislocation), while featuring low energy consumption and a compact design to meet the high standards of industrial large-scale production.

Technical Parameters

Parameter
Specification
Growth Process
Physical Vapor Transport (PVT)
Heating Method
Graphite resistance heating
Adaptable Crystal Sizes
6 inch, 8 inch, 12 inch (switchable; chamber replacement time < 4 hours)
Compatible Crystal Types
Conductive type, semi-insulating type, N-type (full series)
Maximum Operating Temperature
≥2400℃
Ultimate Vacuum
≤9×10⁻⁵Pa (cold furnace condition)
Pressure Rise Rate
≤1.0Pa/12h (cold furnace)
Crystal Growth Power
34.0KW
Power Control Accuracy
±0.15% (under stable growth conditions)
Pressure Control Accuracy
0.15Pa (growth stage); fluctuation <±0.001 Torr (at 1.0Torr)
Crystal Defect Density
BPD < 381 ea/cm²; TED < 1054 ea/cm²
Crystal Growth Rate
0.2-0.3mm/h
Crystal Growth Height
30-40mm
Overall Dimensions (W×D×H)
≤1800mm×3300mm×2700mm


Core Advantages


 Full-Size Compatibility

Enables stable growth of 6-inch, 8-inch, and 12-inch silicon carbide crystals, fully compatible with conductive, semi-insulating, and N-type material systems. It covers the production needs of products with different specifications and adapts to diverse application scenarios.


● Strong Process Stability

The 8-inch crystals have excellent 4H polytype consistency, stable surface shape, and high repeatability; the 12-inch silicon carbide crystal growth technology has completed verification with high mass production feasibility.


● Low Crystal Defect Rate

Through precise control of temperature, pressure, and power, crystal defects are effectively reduced with key indicators meeting standards—EPD=1435 ea/cm², BPD=381 ea/cm², TSD=0 ea/cm², and TED=1054 ea/cm². All defect indicators meet high-grade crystal quality requirements, significantly improving ingot yield.


● Controllable Operating Costs

It has the lowest energy consumption among similar products. Core components (such as thermal insulation shields) have a long replacement cycle of 6-12 months, reducing comprehensive operating costs.


● Plug-and-Play Convenience

Customized recipe and process packages based on equipment characteristics, verified through long-term and multi-batch production, allowing immediate production after installation.


● Safety and Reliability

Adopts a special anti-arc spark design to eliminate potential safety hazards; real-time monitoring and early warning functions proactively avoid operational risks.


● Excellent Vacuum Performance

The ultimate vacuum and pressure rise rate indicators exceed internationally leading levels, ensuring a clean environment for crystal growth.


● Intelligent Operation and Maintenance

Features an intuitive HMI interface combined with comprehensive data recording, supporting optional remote monitoring functions for efficient and convenient production management.


Visual Display of Core Performance


Temperature Control Accuracy Curve

Temperature Control Accuracy Curve

Temperature control accuracy of the crystal growth furnace ≤ ±0.3°C; Overview of the temperature curve



Pressure Control Accuracy Graph


Pressure Control Accuracy Graph

Pressure control accuracy of the crystal growth furnace: 1.0 Torr, Pressure control accuracy: 0.001 Torr


Power Stability Precision


Stability and consistency between furnaces/batches: The stability accuracy of power

Power Stability Precision

Under the crystal growth status, the accuracy of power control during stable crystal growth is ±0.15%.


Veteksemicon products shop

Veteksemicon products shop



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